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Ansys

https://ansyshelp.ansys.com/public/Views/Secured/corp/v251/en/fensap_manual/section_jrw_zfr_dw.html

Overall: Reference-manual section from FENSAP-ICE (aircraft ice-protection-system) docs — concrete, numeric CHT setup guidance (interface meshing tolerances, boundary/solid-layer mesh counts, staged dry-air-then-wet-air validation). Aimed at a niche application but the meshing/workflow discipline generalizes to any CHT problem.

Video ideas:

  • Why CHT interface meshes need matching resolution on both sides of the solid/fluid boundary — and what breaks when they don't
  • How many mesh layers do you actually need through a thin solid wall in CHT (3–5, not one) — and why
  • y+ under 1 explained: why boundary-layer meshing at a CHT interface makes or breaks h accuracy
  • The "dry-air first" validation trick: sanity-check materials/BCs/heater power on a simplified CHT run before the full physics
  • Where NOT to put a heat source in a solid mesh — why placing it right at a CHT interface causes problems
  • Isothermal vs. adiabatic wall boundary conditions for CHT setup: when to use which
  • Grid non-conformity at CHT interfaces: how much gap/overlap/penetration is tolerable before results degrade

Feature gaps:

  • Automated/documented check that interface grid resolutions are comparable on both sides of a CHT boundary
  • Enforced/recommended minimum element-layer count (e.g. 3-5) through thin solid walls, vs. allowing a single-layer solid mesh
  • Automated detection/warning for heat sources or BCs placed directly at a CHT interface patch
  • A staged "simplified pass first, full physics second" validation workflow to catch setup errors cheaply before a full CHT solve
  • Tolerance checking for interface geometry non-conformity (gap/overlap/penetration) between domains sharing a CHT boundary
  • Transition-aware turbulence modeling (e.g. SST-intermittency) as an alternative to a hard laminar/kOmegaSST regime switch

https://innovationspace.ansys.com/knowledge/forums/topic/tips-for-resolving-unphysical-temperatures-and-poor-convergence-with-cht-cases-2/

Overall: Short, practical FAQ-style forum post (Ansys Innovation Space / CFX knowledge base) diagnosing why CHT cases produce unphysical high temperatures or fail to converge. A troubleshooting note, not a tutorial, but specific and actionable.

Video ideas:

  • Why bad mesh orthogonality at a fluid-solid interface causes unphysical hot spots in CHT (the <10° orthogonality-angle rule of thumb)
  • Conformal (1:1) vs. GGI (General Grid Interface) meshing for CHT: when a matched mesh at the interface actually hurts your solution
  • Boundary-layer/inflation resolution at CHT interfaces: how coarse near-wall meshing produces poor temperature-gradient capture
  • A CHT convergence troubleshooting checklist: mesh quality first, interface type second, numerics last

Feature gaps:

  • Non-conformal/mismatched mesh interface handling between fluid and solid regions (Ansys's GGI mapping) — worth checking whether a conforming-only CHT mesher can silently produce interface artifacts that GGI-style tools avoid
  • An expert/advanced numerical-scheme toggle for the CHT interface diffusion term, as a robustness-vs-accuracy tradeoff knob for stubborn non-convergent cases
  • Automated interface mesh-quality diagnostics (flagging low orthogonality angles specifically at fluid-solid CHT boundaries) surfaced as part of mesh QA/reporting

https://www.scribd.com/document/412279480/06-Heat-Transfer

Overall: Official ANSYS FLUENT 14.0 step-by-step tutorial (2012) — a classic electronics-cooling CHT case (heat-generating chip on a board, laminar air cooling). Procedural/UI-driven, not a research piece; Scribd's preview paywalled most of the document, so only the setup/mesh/materials sections were readable.

Video ideas:

  • Chip-on-board CHT walkthrough: how a 1W chip with 10x the PCB's thermal conductivity distributes heat into a laminar air stream
  • Why model air as incompressible-ideal-gas (not constant density) in a case with ~150°C temperature rise but negligible pressure change
  • Verifying mesh independence in CFD via mesh adaption registers and Boolean region operations
  • Picking laminar vs. turbulent in a tight electronics enclosure: reading Reynolds number off channel spacing (this case: Re≈870, laminar)
  • Common CHT material-setup mistakes: assigning distinct solid conductivities to chip vs. board without accidentally overwriting defaults

Feature gaps:

  • Mesh-independence verification workflow (adaption registers + Boolean ops on refinement regions) as a guided/built-in step, vs. manual mesh studies
  • Per-zone volumetric heat source terms (e.g. 1W generated inside a specific solid sub-region), as opposed to only wall-flux or wall-temperature BCs
  • Incompressible-ideal-gas (temperature-dependent, pressure-independent) density model as an alternative to Boussinesq for forced-convection cases with large temperature rise